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A Closed-loop Transcutaneous Power Transmission System with Thermal Control for Artificial Urethral Valve Driven by SMA Actuator

Department of Bioengineering and Robotics, Graduate School of Engineering, Tohoku University 6-6-04 Aoba-yama, Sendai 980-8579, Japan

Feng Wang

Department of Bioengineering and Robotics, Graduate School of Engineering, Tohoku University 6-6-04 Aoba-yama, Sendai 980-8579, Japan, wang{at}rose.mech.tohoku.ac.jp

Kazuhiro Abe

Department of Bioengineering and Robotics, Graduate School of Engineering, Tohoku University 6-6-04 Aoba-yama, Sendai 980-8579, Japan

Yoichi Arai

Department of Urology, School of Medicine, Tohoku University, 1-1 Seiryo-machi Aoba-ku, Sendai 980-8574, Japan

Haruo Nakagawa

Department of Urology, School of Medicine, Tohoku University, 1-1 Seiryo-machi Aoba-ku, Sendai 980-8574, Japan

Seiji Chonan

Department of Bioengineering and Robotics, Graduate School of Engineering, Tohoku University 6-6-04 Aoba-yama, Sendai 980-8579, Japan

This article presents the development of an implanted artificial urethral valve that is used for the treatment of urinary incontinence, with emphasis on a transcutaneous power transmission system with closed-loop thermal control function. The valve uses a shape memory alloy (SMA) plate as the actuator, which is activated with batteries placed outside a patient’s body using a transcutaneous power transmission system. The power transmission system is equipped with an implanted temperature monitor circuit and a temperature controller to prevent the SMA actuator from being overheated during a prolonged urination. Laboratory experiments and animal experiments, both in vitro and in vivo, show that the developed power transmission system can successfully control the temperature of the SMA actuator to activate the valve without excessive heating of the SMA actuator.

Key Words: artificial urethral valve • shape memory alloy • nitinol • transcutaneous power transmission • closed-loop temperature control

This version was published on September 1, 2006

Journal of Intelligent Material Systems and Structures, Vol. 17, No. 8-9, 779-786 (2006)
DOI: 10.1177/1045389X06055832


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