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Journal of Intelligent Material Systems and Structures
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18/11/1203    most recent
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Multiple Surface Cracking of a Piezoelectric Layer Bonded to an Elastic Substrate Under Dynamic Anti-plane Electromechanical Impacts

B.L. Wang

Center for Composite Materials, Harbin Institute of Technology, Harbin 150001, PR China, wangbl2001{at}hotmail.com

J.C. Han

Center for Composite Materials, Harbin Institute of Technology, Harbin 150001, PR China

In engineering applications, piezoelectric materials are usually bonded to elastic substrates to form so-called smart materials and structures. Such materials and structures can respond to external electromechanical environments, which are often transient. This article studies a periodic array of surface cracks in a piezoelectric layer bonded to an elastic substrate subjected to transient electromechanical loads. The anti-plane mechanical and in-plane electrical loads are investigated. A system of singular integral equations is formulated in terms of the crack surface anti-plane displacement and in-plane electrical potential. Effects of crack spacing and electromechanical coupling on the time-dependent crack tip field intensity factors are investigated in detail. Both a single piezoelectric layer and a piezoelectric layer bonded to an elastic substrate are analyzed for electrically impermeable and permeable crack assumptions.

Key Words: piezoelectric materials • dynamic fracture mechanics • periodic cracks.

This version was published on November 1, 2007

Journal of Intelligent Material Systems and Structures, Vol. 18, No. 11, 1203-1213 (2007)
DOI: 10.1177/1045389X06072752
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