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Fabrication Methods for High Aspect Ratio Microstructures

Masayoshi Esashi

Department of Mechatronics and Precision Engineering, Faculty of Engineering, Tohoku University, Aoba-ku, Sendai 980-77, Japan

Yoshio Yamashita

SORTEC Corporation, 16-1 Wadai, Tsukuba, Ibaraki 300-42, Japan

Two methods for fabricating high aspect ratio (depth/width) microstructures were developed and compared. The first method is a modified deep X-ray lithography process with thick negative resist. For preventing pattern collapse caused by surface tension while the rinse liquid is evaporated, some post-rinse drying processes were investigated. The second method is a directional etching of polyimide by 02 reactive ion etching (RIE). The advantage of the latter method is that the surface tension of liquids does not affect the microstructure in a dry atmosphere. In both methods, aspect ratio of 10 was achieved in polymer molds for electroplating at pattern width of 5,um without collapse.

Journal of Intelligent Material Systems and Structures, Vol. 8, No. 2, 173-176 (1997)
DOI: 10.1177/1045389X9700800207


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